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Silla SOCKET

Superior wafer level test solution combining DS Testics's powerful
and innovative WLCSP test technology

high test yields for the key parts of ever-evolving smart devices. This is also a reliable solution for the development environment to generate demand for more detailed and precise processes.

silla socket

Wafer Level TEST

Type Characteristics

  • 01Low contact resistance
  • 02Materials with high durability for temperature and humidity change
  • 03Design to secure strength based on structural analysis
  • 04Quality improvement through precision processing
  • 05Convenient maintenance
  • 06Excellent signal integrity
  • 07Ceramic materials applied

Composition

  • 5th Generation Mobile Telecommunication

    PMIC

  • Defense Industry

    Wafer

  • Processor In Memory

    Processor In Memory

sillaSocket